1.6T OSFP Modules

As AI, cloud computing, and big data continue to drive exponential growth in global data traffic, hyperscale data centers and enterprise core networks demand higher bandwidth, lower latency, and greater energy efficiency in optical interconnect solutions. MF-Telecom’s 1.6T OSFP Modules series is engineered to meet these evolving demands, offering a comprehensive range of high-performance optical transceivers that comply with OSFP MSA, IEEE 802.3df standards, and CMIS 5.x management interface specifications.

Our 1.6T OSFP Modules portfolio covers all key application scenarios, from short-reach AI cluster interconnection to medium and long-reach data center interconnects. Leveraging advanced silicon photonics technology and 3nm DSP chips, these modules deliver ultra-high-speed connectivity while minimizing power consumption, making them ideal for next-generation AI, HPC, and cloud network architectures. All modules undergo 100% strict testing before shipment, ensuring full compatibility with mainstream switches and routers from Cisco, Huawei, H3C, ZTE, and NVIDIA Quantum-X800 series.

MF-Telecom offers a complete lineup of 1.6T OSFP modules, tailored to different transmission distances and application needs, with consistent quality and reliable performance:

  • 1.6T OSFP 2xVR4: 850nm wavelength, MPO interface, 30-100m transmission over multi-mode fiber, ideal for short-reach AI cluster interconnection, equipped with 200G/Lane VCSEL lasers for efficient connectivity.

  • 1.6T OSFP 2xDR4: 1310nm wavelength, dual MPO-12/APC interfaces, up to 500m transmission over single-mode fiber, featuring low power consumption (≤25W) and compatibility with NVIDIA DGX GB300/B300 servers.

  • 1.6T OSFP 2xFR4: 1310nm wavelength, 2km transmission distance, combining silicon photonics and 3nm DSP technology, perfect for medium-reach data center interconnection.

  • 1.6T OSFP Coherent-lite: O-band optimized, up to 20km transmission, equipped with compact coherent DSP and high-performance silicon photonics, suitable for long-reach data center interconnects.

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